Multilevel System for Thermal Design, Control and Management of Electronic Components
Author(s) : I. A. KHARITONOV , K. O. PETROSYANTS , N.I. RYABOV , P.A. KOZYNKO
Abstract
The methodology and software tools for multi-level thermal and electro-thermal design of electronic components are presented. The discussion covers 2D/3D constructions of: 1) discrete and integrated semiconductor devices; 2) monolithic and hybrid ICs and VLSIs; 3) Hybrid ICs, MCMs and PCBs. The actual test validation using IR thermal measurement is demonstrated for all types of components.
No fo Author(s) : 4
Page(s) : 22 - 27
Electronic ISSN : 2319 - 7498
Volume 3 :
Issue 2
Full Paper PDF
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